By Markus Graf, Diego Barrettino, Henry P. Baltes, Andreas Hierlemann
The publication "CMOS Hotplate Chemical Microsensors" offers a accomplished remedy of the interdisciplinary box of CMOS technology-based chemical microsensor structures, and, particularly, of microhotplate-based platforms. The ebook is, at the one hand, certain at scientists and engineers which are drawn to getting first insights within the box of microhotplates and comparable chemical sensing, considering all worthy basic wisdom is integrated. however, it additionally addresses specialists within the box because it presents particular details on all very important matters regarding knowing microhotplates and, particularly, microhotplate-based chemical sensors in CMOS technology.A huge variety of microhotplate realizations and integrated-sensor-system implementations illustrate the present state-of-the-art and, while, supply an effect of the longer term capability of chemical microsensors in CMOS know-how. because microsensors produce "microsignals", sensor miniaturization with out sensor integration is, in lots of circumstances, at risk of failure. This e-book can assist to bare the advantages of utilizing built-in electronics and CMOS-technology for constructing microhotplates and the corresponding chemical microsensor structures and, particularly, the benefits that outcome from figuring out monolithically built-in sensor structures comprising transducers and linked circuitry on a unmarried chip.
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Additional resources for CMOS Hotplate Chemical Microsensors
1) with the results of Eqs. 13) holds, the second integral on the right-hand side of Eq. 8) vanishes. The membrane consists of a stack of thin ﬁlms of a certain thickness, di , with characteristic isotropic and homogeneous material constants ci and κi (see Fig. 2). The composition of the stack locally depends on the x,y-coordinates. 14) i and varies according to the microhotplate structure. , ambient temperature, corresponding to the unheated state of the microhotplate. βi is the ﬁrst-order temperature coeﬃcient of the heat conductivity and ΔT = T − T .
Afterwards, the membrane model is transferred back to a simpliﬁed 3-d description of the membrane, the diﬀerent sections of which exhibit homogeneous heat conductivity and constant thickness. Finally, the membrane structure is combined with the supporting silicon frame and the surrounding air. The result is a geometry model for the FEM simulation as discussed in Sect. 3. The input parameters for a lumped-model description (Sect. 4) of the microhotplate are calculated from the simulation results.
9. The abbreviations S to S denote the simulated temperatures at the characteristic locations of the temperature sensors. C µm at C. 42 4 Microhotplates in CMOS Technology Fig. 8. Relative temperature diﬀerences between the temperature sensors T to T and T Fig. 9. Simulated relative temperature diﬀerences, S to S , between the diﬀerent temperature sensor locations, T to T , and T . 3 Temperature Distribution Assessment of a Coated Microhotplate Since the bare uncoated membrane represents a worst-case-scenario in terms of temperature homogeneity, it is mandatory to analyze the eﬀect of the tin-oxide droplet on the temperature distribution.